Sondrel, a leading provider of ultra-complex chips for global technology brands, has reported a growing demand for its 3nm design services for custom ASICs. The need for 3nm technology arises from the requirements of the next generation of products, particularly AI-based designs that necessitate significant computing power to process vast amounts of data.

The adoption of 3nm technology offers notable improvements in power, area, and capabilities, leveraging Sondrel's expertise in designing ultra-complex ASICs at 5nm and its investment in cutting-edge SOC design flows. This combination of performance, power efficiency, and area reduction, along with access to best-in-class third-party IP, allows Sondrel's chip designers to stay ahead of system-level demands.

The advantages of 3nm process technology over previous generations include:

1.Higher Transistor Density: The 3nm process enables the packing of more transistors into the same chip area compared to 5nm technology. This increased transistor density directly enhances the chip's performance.

2.Performance Improvement: The 3nm process delivers better performance in terms of speed and computational capabilities. Devices utilizing this technology exhibit enhanced responsiveness and efficiency.

3.Improved Energy Efficiency: Chips manufactured with the 3nm process consume less power while maintaining or improving their performance. This translates to longer battery life for mobile devices and reduced energy consumption in data centers.

Graham Curren, the founder and CEO of Sondrel, emphasizes the company's commitment to being at the forefront of technology. Sondrel's expertise in designing ultra-complex ASICs helps their customers deliver the innovation required to maintain their market leadership. With each step down in process node, the number of transistors increases significantly, reaching several hundred billion transistors for a custom chip at 3nm. Sondrel invests in state-of-the-art EDA tools and develops rigorous methodologies for chip design to ensure the successful functioning of these complex chips.

Ed Loverseed, Sondrel's Head of Engineering, highlights the company's focus on reducing risk for customers. Sondrel maintains frequent interactions with customers throughout the discovery and specification stages of the project, handling any problems that arise. This allows customers to concentrate on their core competencies while trusting Sondrel to deliver high-quality ASIC designs on time and within budget.

Effective project management is crucial in managing the various teams of engineers working on different aspects of each chip design project. Sondrel's experience of over twenty years ensures that projects are delivered on time and with a high level of service. The company's expertise and track record make it one of the few capable of providing 3nm design services.